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 SI2321DS
New Product
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
- 20
FEATURES
D TrenchFETr Power MOSFETS ID (A)
- 3.3 - 2.8 - 2.3
rDS(on) (W)
0.057 @ VGS = - 4.5 V 0.076 @ VGS = - 2.5 V 0.110 @ VGS = - 1.8 V
APPLICATIONS
D Load Switch D PA Switch
TO-236 (SOT-23)
G 1 3 S 2 D Ordering Information: SI2321DS-T1
Top View SI2321DS *(D1) *Marking Code
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Currenta Continuous Source Current (Diode Conduction)a Power Dissipationa Operating Junction and Storage Temperature Range TA= 25_C TA= 70_C PD TJ, Tstg TA= 25_C TA= 70_C ID IDM IS - 0.74 0.89 0.57 - 55 to 150
Symbol
VDS VGS
5 sec
- 20 "8 - 3.3 - 2.6 - 12
Steady State
Unit
V
- 2.9 - 2.3 A - 0.59 0.71 0.45 W _C
THERMAL RESISTANCE RATINGS
Parameter
t 5 sec. Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on FR4 Board. b. t v5 sec. For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm Document Number: 72210 S-03986--Rev. A, 19-May-03 www.vishay.com Steady State Steady State RthJA RthJF
Symbol
Typical
115 140 60
Maximum
140 175 75
Unit
_C/W
1
SI2321DS
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Limits Parameter Static
Drain-Source Breakdown Voltage Gate-Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta V(BR)DSS VGS(th) IGSS IDSS ID(on) VGS = 0 V, ID = - 10 mA VDS = VGS, ID = - 250 mA VDS = 0 V, VGS = "8 V VDS = 16 V, VGS = 0 V VDS = 16 V, VGS = 0 V, TJ = 55_C VDS v - 5 V, VGS = - 4.5 V VGS = - 4.5 V, ID = - 3.3 A Drain-Source On-Resistancea rDS(on) () VGS = - 2.5 V, ID = - 2.8 A VGS = - 1.8 V, ID = - 2.3 A Forward Transconductancea Diode Forward Voltage gfs VSD VDS = - 5 V, ID = - 3.3 A IS = - 1.6 A, VGS = 0 V -6 0.044 0.061 0.084 3 - 1.2 0.057 0.076 0.110 S V W - 20 - 0.40 - 0.90 "100 -1 - 10 mA A V nA
Symbol
Test Conditions
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Qg Qgs Qgd Ciss Coss Crss VDS = - 6 V, VGS = 0, f = 1 MHz VDS = - 6 V, VGS = - 4.5 V ID ^ - 3.3 A 8 1.2 2.2 715 170 120 pF 13 nC
Switchingb
td(on) Turn-On Turn On Time tr td(off) tf Notes a. b. c. For DESIGN AID ONLY, not subject to production testing. Pulse test: PW v300 ms duty cycle v2%. Switching time is essentially independent of operating temperature. VDD = - 6 V, RL = 6 W ID ^ - 1 0 A VGEN = - 4.5 V 1.0 A, 45 RG = 6 W 15 35 60 40 25 55 ns 90 60
Turn-Off Time
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2
Document Number: 72210 S-03986--Rev. A, 19-May-03
SI2321DS
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
12 VGS = 4.5 thru 2.5 V 10 2V 10 12
Vishay Siliconix
Transfer Characteristics
I D - Drain Current (A)
8
I D - Drain Current (A)
8
6 1.5 V 4
6
4 TC = 125_C 2 25_C - 55_C
2 0.5 V 0 0.0 1.0 V 1.6 2.0
0.4
0.8
1.2
0 0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.30 1200
Capacitance
r DS(on) - On-Resistance ( W )
0.25 C - Capacitance (pF) 900 Ciss
0.20
0.15 VGS = 1.8 V 0.10 VGS = 2.5 V
600
300 Coss
0.05 VGS = 4.5 V 0.00 0 2 4 6 8 10 12 0 0 4 Crss
8
12
16
20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 3.3 A
Normalized On-Resistance vs. Junction Temperature
1.5 VGS = 4.5 V ID = 3.3 A
3
r DS(on) - On-Resistance (W) (Normalized) 4 6 8 10
4
1.3
1.1
2
0.9
1
0.7
0 0 2
0.5 - 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Document Number: 72210 S-03986--Rev. A, 19-May-03
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3
SI2321DS
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
20 10 r DS(on) - On-Resistance ( W ) 0.4 I S - Source Current (A) 0.5
On-Resistance vs. Gate-to-Source Voltage
0.3
TJ = 150_C 1
TJ = 25_C
0.2
ID = 3.3 A
0.1
0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.0 0 1 2 3 4 5 6 7 8
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.4 ID = 250 mA 8 10
Single Pulse Power
0.3 V GS(th) Variance (V)
0.2 Power (W) 6
0.1
4 TA = 25_C
0.0 2
- 0.1
- 0.2 - 50
0 - 25 0 25 50 75 100 125 150 0.01 0.1 1 Time (sec) 10 100 600 TJ - Temperature (_C)
Safe Operating Area
100 Limited by rDS(on) 10 I D - Drain Current (A) 100 ms, 10 ms
1
1 ms 10 ms 100 ms
0.1
TA = 25_C Single Pulse
dc, 100 s, 10 s, 1 s
0.01 0.1 1 10 100
VDS - Drain-to-Source Voltage (V) www.vishay.com Document Number: 72210 S-03986--Rev. A, 19-May-03
4
SI2321DS
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
Vishay Siliconix
0.2 0.1 0.1 0.05 0.02
Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2
2. Per Unit Base = RthJA = 130_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1
10
100
600
Square Wave Pulse Duration (sec)
Document Number: 72210 S-03986--Rev. A, 19-May-03
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5


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